C10100 vs C10200 vs C11000 copper

How oxygen-free electronic (OFE), oxygen-free (OF) and electrolytic tough pitch (ETP) copper compare, and which one to specify for busbar and rod.

Side by side

Reference values for each grade. Final specifications are confirmed with each order.

Property C10100 OFEWhat Rearden makes C10200 OFOxygen-free C11000 ETPMost common grade
Also called Oxygen-free electronic Oxygen-free, often sold as OFHC Electrolytic tough pitch
Minimum copper 99.99% 99.95% 99.90%
Oxygen 5 ppm max. 10 ppm max. 200–400 ppm (typical)
Electrical conductivity (annealed) 101% IACS min. About 101% IACS 100% IACS min.
H₂ or reducing-atmosphere brazing Yes, no embrittlement Yes, no oxide to react No: embrittles above ~700 °F (370 °C)
Laser or electron-beam welding Sound joints, no oxide porosity Low porosity Porosity risk
High vacuum and electron devices Suitable: low outgassing, covered by ASTM F68 Acceptable for many uses Not recommended
Bar standard ASTM B187 ASTM B187 ASTM B187
Relative cost Highest Middle Lowest

Which grade to specify

C10100 OFE

When the part will be brazed in hydrogen, laser or electron-beam welded, plated, bent tight or used in vacuum, or when the drawing calls for OFE.

C10200 OF

When the drawing calls for oxygen-free copper at 10 ppm. C10100 meets that chemistry too, so we can supply and certify against a C10200 callout.

C11000 ETP

When the bar is cut, drilled, bolted and left alone in still air. If none of the conditions above apply to your part, ETP is the economical choice.

Common questions

Is C10100 the same as OFHC copper?

OFHC is a trade name for oxygen-free, high-conductivity copper, most often used for C10200. C10100, also called OFE, is the higher-purity grade, with 99.99% copper and 5 ppm oxygen maximum.

Can C10100 be supplied against a C10200 callout?

Yes. C10100 meets the C10200 chemistry, and we certify against the grade on your drawing, reporting the measured values for your lot.

Is conductivity the reason to choose OFE?

Usually not. At room temperature, OFE and ETP conductivity are close: 101% against 100% IACS minimum. The difference is oxygen, and how the metal behaves when you braze, weld, bend or draw it.

Why does oxygen cause hydrogen embrittlement?

In ETP copper, oxygen sits as cuprous oxide (Cu₂O) at the grain boundaries. In a hydrogen atmosphere it reacts to form steam, which opens voids and cracks. OFE copper has no oxide to react.

Which ASTM standards apply?

ASTM B187 covers copper bus bar, bar, rod and shapes. ASTM B49 covers copper rod for electrical purposes, the feedstock for wire drawing. ASTM F68 covers oxygen-free copper for electron devices.

Not sure which grade you need?

Send us your drawing or your application and process, and we will recommend the grade. Final specifications are confirmed with each order.

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